En

仿真與設計

仿真與設計

Characterization Services

As the electronics industry moves towards more complex semiconductor packages that are smaller, faster and higher performance, engineers are faced with the challenge of trying to fit more powerful components into a smaller area without causing long term reliability issues or stress on a package.  Delivering the optimum package design requires an in-depth analysis of key package measurements and simulation.

JCET offers the following characterization services:

JCET’s worldwide package characterization teams located in China, Singapore, South Korea, and the United States provide advanced package characterization services for our global customers to ensure they have high quality, high performance, reliable and cost effective package designs that meet their market requirements. 

Full-Service Packaging Design Centers

JCET collaborates with customers on die and package designs to provide the best possible products in terms of performance, quality, cycle time and cost. JCET’s full-service package Design Centers help customers determine the optimum package for their specific end product.   

Design Center services include: 

? Customer-centric designers 
Mobile design capability 
? State-of-the-art design tools 

? Integration of customer supplied designs into JCET’s design system 

? Project data management 


Proven Experience

JCET’s world class design team has extensive experienced in the mobile, networking, computing, consumer and automotive markets. Their experience covers a wide range of Laminate, leadframe and wafer level package designs, including single die, multi-die, Package-on-Package (PoP), Integrated Passive Devices (IPD) and advanced System-in-Package (SiP). JCET’s dedicated design team has the necessary experience to provide complex designs that meet or exceed assembly and cost targets.

Design for Performance

Today's package designs adhere to stringent thermal and electrical requirements while providing high-end performance for our customers’ end products. To ensure a semiconductor package meet performance requirements, JCET’s Design and Characterization Team works closely with the customer through co-design while the integrated circuit (IC) is in development. The “Co-Design” of a package provides the best environment for optimum performance. JCET’s package designs meet our customers’ needs whether as a single chip device or complex System-in-Package (SiP).   

The Design Process

JCET manages the design process using our Product Data Management system. From the moment a request enters our system the design team works with our characterization experts and our customers to understand their needs for each design. As each new design is received, it undergoes a feasibility to determine if the package will meet the requirements of our factories, suppliers and customers. Our designers collaborate with customers to ensure the optimum package is produced with consideration to cost, assembly and function. 

Design Tool Sets

? Cadence: SiP and APD 
? AutoDesk: AutoCad 
? Downstream: CAM350 
? Internally developed support tools
聯系我們 |  客戶查詢 |  法律聲明

聯系我們 客戶查詢 法律聲明

版權所有@江蘇長電科技股份有限公司 保留一切權利 蘇ICP備05082751號32028102000607

版權所有@江蘇長電科技股份有限公司
保留一切權利
蘇ICP備05082751號 32028102000607
(^ω^)MG好多怪兽游戏 mg摆脱5个冰球突破 哪些彩票有二分彩票 白山棋牌游戏下载 老友内蒙古麻将链接 微信红包麻将手机版 幸运飞艇官网 黄金棋牌游戏官网 官方网上棋牌 麻将来了怎么开房 七星彩预测技巧 广东11选五5是合法的吗 福建36选7开奖时间 四川金七乐开奖结果走势图 腾游娱乐中心官方网站 免费单机炸金花 山西繁峙麻将